In the semiconductor industry, wafers are thin slices of silicone ingots that are to be used for many different applications. Semiconductor wafer polishing is one of the most important steps to preparing the wafer for use.
Many different types of polishing tools can be used, but precision force control is required to create consistent products. In this application, 7 MM1s mounted on a SBM-7 sub-base manifold are controlling to force on spring loaded cylinders, used to polish the wafers.
The sub-base has a common air supply port and a common exhaust port, but each MM unit can work independently if necessary.
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